Our profile is nondestructive and destructive physical sample investigation in the electronics industry. We support technology and product development and serial production as well. We are experienced in the following fields: - sheet metal and die cast manufacturing and its aging defects - plastic manufacturing and its aging defects - PCB / LTCC / DBC based products aging characterization and its quality analyses
Stereo microscopy investigation
Special mechanical opening of samples to avoid influencing the investigation results
High precision sectioning down to 36 micron gold bonds.
